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Semiconductors

Chips, fabs and the race to build them

Everything about this industry

From a beam of light on silicon to the brain of every device you own

Foundation

Why does this industry exist?

This industry exists because a transistor, a tiny electronic switch, is the fundamental building block of every piece of modern computing, and packing billions of them onto a single chip is what turns a lump of purified sand into a smartphone processor. No other manufactured product compresses this much precision engineering, physics and capital into something small enough to fit on a fingertip.

The second reason is that chips have become the substrate almost every other industry now depends on. A car, a washing machine, a fighter jet and a UPI payment terminal all rely on chips, which is exactly why chip supply has become treated as a national security and economic sovereignty issue, not merely a component sourcing question, by governments including India's.

Almost nothing electronic works without a chip, and almost nothing India buys electronically is chip-independent, from a car's engine control unit to a UPI payment terminal. This industry designs, manufactures, packages and tests those chips, a chain so specialised that even the world's richest technology companies depend on a tiny handful of suppliers for the most critical steps.

India's position in this industry is a deliberate, staged bet: rather than trying to leap straight to leading-edge chip fabrication, the country has built its first real capability in design, testing and packaging, the less capital-intensive layers, while its first high-volume fab targets a mature, well-understood process node rather than the cutting edge.

Value chain

01DesignChip architecture and circuitdesign, using licensed IP coresand Electronic Design Automationsoftware, before a single wafer istouched.02FabricationThe wafer fab, where lithographyand hundreds of other steps turn ablank silicon wafer into hundredsof finished chip dies.03Assembly, Test &Packaging (ATMP)Dies are packaged, tested andmarked, increasingly usingadvanced packaging techniques,before shipping to device makers.

Yield: the number that decides whether any of this is actually profitable

Every other number in this industry, node size, fab cost, packaging sophistication, ultimately funnels into one governing metric: yield rate, the share of chips on a wafer that actually work. A fab pays roughly the same cost to process a wafer regardless of whether 95% or 60% of the resulting chips are sellable, so yield is not a quality footnote, it is the direct multiplier on whether a fab makes money at all.

This is exactly why new fabs and new process nodes are treated cautiously in the early years. Yield typically starts low on any new line and climbs over months or years as engineers eliminate defect sources, which is why India's own semiconductor ambitions are consistently described as a multi-year project rather than something that shows commercial results overnight.

The industry's basic playbooks

Chip companies specialise in genuinely different, often mutually exclusive, parts of this value chain.

Fabless design companies

Companies like Qualcomm and most Indian chip design startups, which design chips but outsource actual manufacturing entirely to a foundry.

Foundries

Pure manufacturing specialists like TSMC, and India's own Tata-PSMC fab, that make chips designed by other companies rather than their own.

IDMs (Integrated Device Manufacturers)

Companies like Micron that both design and manufacture their own chips end to end, rather than splitting the two functions.

Anatomy: the physical chain, part by part

Behind the financial structure, this industry is a set of very specific physical facilities, most of which India is only now building for the first time.

Design houseIndian fabless startups, global R&D centresWhere chip architecture and circuit design actually happen
Wafer fabTata Electronics-PSMC, DholeraIndia's first high-volume fab, targeting 28nm production
ATMP facilityMicron, SanandAssembles, tests and packages chips, India's first entry point into the chain
EUV lithography equipmentASML (Netherlands)The sole global supplier of the equipment leading-edge fabs need
Numbers
Global size
~$628B (2025)

Global semiconductor market, expected to approach $975B-1T by 2026 on an AI infrastructure-driven boom.

2025 estimate
India size
~$43-53B (2025)

India's own semiconductor market (chips consumed, not yet chips made); estimates vary. India Semiconductor Mission and PLI/DLI outlay together total roughly $9.1B in incentives.

2025 estimates

Where global chip manufacturing actually concentrates

"India is building a fab" means little without seeing how extreme the existing concentration in this industry already is.

% of global foundry revenue
2025Foundry market
  • TSMC69.9%
  • Samsung7.2%
  • Rest of foundry market22.9%

India's domestic semiconductor market, 2022 to 2025 ($ billion)

Reliable market-sizing data only goes back a few years for this genuinely new industry focus area (the Semiconductor Mission itself launched in 2021-22); even over this short window the market has roughly doubled.

India's domestic semiconductor market, 2022 to 2025 ($ billion)
20B30B40B50B60B2022202552B

Raw materials

Silicon wafers

Ultra-pure silicon discs that form the base of every chip; India currently imports essentially all of its wafers.

Specialty gases & chemicals

Extremely high-purity gases and chemicals used throughout fabrication, most sourced from a handful of global specialist suppliers.

Lithography & fab equipment

Capital equipment, EUV machines especially, concentrated in a tiny number of global suppliers, chiefly ASML, Applied Materials and ASM.

What creates demand

  • AI infrastructure buildout

    Data centre and AI accelerator demand is currently the single fastest-growing driver of global chip demand and pricing.

  • India's own electronics manufacturing growth

    Expanding domestic smartphone, EV and industrial electronics assembly directly increases India's own chip consumption.

  • Automotive electrification

    EVs use several times more chips per vehicle than a comparable combustion vehicle, from battery management to motor control.

  • Government incentive-driven capacity

    PLI and DLI incentives are directly pulling forward investment decisions that might otherwise have gone to other countries.

What holds supply back

  • Zero domestic wafer & chemical supply

    India currently has no meaningful domestic supply of the ultra-pure silicon wafers and specialty chemicals fabs need.

  • No access to leading-edge lithography

    India's first fab targets 28nm precisely because leading-edge EUV equipment access remains tightly restricted globally.

  • Talent pipeline still building

    India has strong chip design talent but a much smaller pool of experienced fab process engineers, a genuinely different skill set.

  • Multi-year yield ramp ahead

    Even with capital and equipment secured, converting a new fab into a consistently profitable, high-yield operation takes years, not months.

Trade & balance of payments

India currently imports nearly all the chips it consumes, alongside importing essentially all of the fab equipment, wafers and specialty chemicals now going into its first domestic fab and ATMP facilities. This is a rare case where India's declared long-term strategy is to convert a large existing import bill into domestic production capacity, rather than the more familiar story of an entrenched, structural import dependency the country cannot realistically close.

The investment scale involved is substantial for a first-generation effort. The Tata-PSMC fab alone represents roughly Rs 91,000 crore (~$10.9 billion) of investment, targeting first silicon in late 2026, while Micron's Sanand ATMP facility, a $2.75 billion investment, was inaugurated in February 2026 and began shipping memory modules to Dell and HP within weeks. Combined PLI and DLI government incentives of roughly $9.1 billion are structured to cut qualifying projects' capital costs by up to 50%, directly changing the investment calculus for global chip companies choosing where to build next.

~Rs 91,000 crore (~$10.9B)
Tata-PSMC fab investment
~$2.75B
Micron Sanand ATMP investment
~$9.1B
Combined PLI + DLI incentive outlay
Up to 50%
Capex reduction for qualifying projects
India semiconductor incentive-backed investment milestones
0$B5$B10$B15$B20$BMicron ATMPTata-PSMC fab10.9$B

10 years ago vs now

A decade ago

Around 2015-16, India had essentially no domestic chip fabrication or advanced packaging capacity of any kind, semiconductor policy discussion was largely aspirational, and India's role in the global chip industry was almost entirely as a design and R&D talent pool for foreign companies, not as a manufacturing location.

Now

India has its first high-volume fab under construction, targeting first silicon in late 2026, its first ATMP facility already shipping product, a combined $9.1 billion PLI and DLI incentive programme actively attracting global investment, and a domestic semiconductor market estimated at $43-53 billion, though genuine leading-edge fabrication capability remains years away.

Business

The five forces shaping this industry

Supplier powerHigh

ASML's effective monopoly on EUV lithography, and the extreme concentration of specialty chemical and wafer suppliers, gives equipment and material suppliers enormous leverage over every chipmaker.

Buyer powerHigh

A small number of giant electronics and device companies (Apple, Samsung, the major cloud providers) account for an outsized share of global chip demand, giving them real negotiating leverage over suppliers.

Threat of substitutesLow

There is no realistic substitute for semiconductors in modern computing, though which chip architecture or process node wins a given application is a real, ongoing contest.

Barriers to entryHigh

Leading-edge fabrication requires tens of billions of dollars, access to equipment some suppliers are restricted from selling, and years of yield-ramp experience few companies possess.

Rivalry among existing playersHigh

Foundries, IDMs and fabless design companies all compete intensely, though at the leading edge, TSMC's dominance means much of that rivalry is really a contest for second place.

How the industry actually earns

Foundries like TSMC and India's own Tata-PSMC fab earn a manufacturing margin per wafer processed, with profitability driven overwhelmingly by yield and capacity utilisation rather than chip design cleverness, since they are not selling their own chip designs.

Fabless design companies earn on the margin between what a foundry charges to manufacture their chip and what they can sell the finished, branded chip for, meaning their profitability depends on design differentiation and brand strength rather than manufacturing scale.

ATMP and OSAT companies like Micron's Sanand facility earn a service fee for assembly, testing and packaging, a lower-margin but also lower-capital-intensity business than fabrication, which is exactly why it has been India's practical entry point into the industry.

Cost structure: almost entirely upfront, and almost entirely unforgiving

This is one of the few industries on this site where the upfront-cost story genuinely holds without much qualification. A leading-edge fab costs tens of billions of dollars and years to build before it produces a single sellable chip, and once built, its ongoing running costs are dwarfed by the sheer scale of that initial capital commitment.

What makes this cost structure especially unforgiving is that the payoff is entirely contingent on yield ramping up fast enough, before the process node itself becomes commercially obsolete. A fab that is a generation behind the leading edge by the time it reaches good yield has effectively already lost the race it was built to run.

What it costs to build different layers of this industry

Illustrative investment scale by layer, based on recent announced India projects; actual costs vary enormously by node, scale and technology.

$B
ATMP / packaging facility1-3
Mature-node fab (e.g. 28nm)8-12
Leading-edge fab (2-3nm)20-40
Players & context

Challenges

  1. 01

    India has zero domestic wafer or specialty chemical supply, meaning even its new fab and ATMP facilities depend entirely on imported raw materials.

  2. 02

    The Tata-PSMC fab's success hinges on a multi-year yield ramp that has not yet played out, first silicon is expected only in late 2026.

  3. 03

    India has no near-term path to leading-edge lithography access, capping its fabrication ambitions at mature process nodes for the foreseeable future.

  4. 04

    Global chip demand and pricing are currently being reshaped by an AI infrastructure boom that India's own industry is not yet positioned to capture directly.

  5. 05

    Talent for fab operations, as distinct from chip design, remains a smaller, newer pool in India than the country's already strong design engineering base.

Players, by value chain stage

Fabrication
  • Tata ElectronicsUnlisted
    Building India's first high-volume fab with PSMC, targeting 28nm
  • CG PowerListed
    Semiconductor ATMP joint venture participant
ATMP & packaging
  • Micron TechnologyListed
    Operates India's first major ATMP facility, in Sanand
  • Tata ElectronicsUnlisted
    Also building ATMP capacity in Assam
Design & fabless
  • Qualcomm IndiaListed
    Major chip design R&D presence in India
  • Indian fabless startupsUnlisted
    A growing but still early-stage domestic design ecosystem, supported by DLI

How the major players compare

CompanyStageScaleListed
TSMCFabrication (global)~70% of global foundry revenueYes
Tata ElectronicsFabrication (India)Building India's first high-volume fabNo
Micron TechnologyATMP (India)India's first major ATMP facility, SanandYes
SamsungFabrication (global)~7% of global foundry revenueYes
ASMLEquipment (global)Sole global supplier of EUV lithography systemsYes

Government policy, last 15 years

2021
India Semiconductor Mission (ISM)

The umbrella programme coordinating India's fabrication, ATMP and design incentive schemes under one strategic roof.

2021
Production Linked Incentive (PLI) for semiconductors

Financial incentives to attract fab and ATMP investment, cutting qualifying projects' capital costs by up to 50% combined with DLI.

2022
Design Linked Incentive (DLI)

Support specifically for Indian fabless chip design startups, addressing the design layer of the value chain separately from manufacturing.

2023
Tata-PSMC fab approval

India's first approved high-volume fab, targeting 28nm production at Dholera, Gujarat.

2023
Micron Sanand ATMP approval

India's first major foreign-anchored ATMP investment, inaugurated in February 2026.

2025-26
"Semicon 2.0" expansion

A second wave of incentive-backed project approvals extending India's semiconductor push beyond the first anchor projects.

India & horizon

Recent developments

February 2026
Micron's Sanand ATMP facility inaugurated

India's first major ATMP facility began shipping memory modules to Dell and HP within weeks of inauguration.

2026
Tata-PSMC fab targets first silicon by late 2026

India's first high-volume fab, a Rs 91,000 crore investment, remains on track for its first production milestone.

2025-26
AI-driven global chip demand accelerates

Global semiconductor sales are being pulled toward roughly $975 billion-plus for 2026, driven overwhelmingly by AI infrastructure spending.

2025-26
Additional Semicon 2.0 projects approved

A second wave of PLI/DLI-backed investment approvals extends India's semiconductor ecosystem beyond its first two anchor projects.

What could disrupt this

Yield ramp disappointment

If the Tata-PSMC fab's yield ramp takes longer than planned, investor and government confidence in India's fab strategy could be tested early.

Tightening global export controls

Further restrictions on equipment or technology transfer could constrain even India's mature-node ambitions, not just leading-edge ones.

AI boom concentration risk

A large share of current global chip demand growth is concentrated in AI infrastructure, a segment India's current projects are not positioned to directly serve.

Global chip cycle volatility

Semiconductors have historically been a boom-bust industry; a downturn during India's early capacity build-out could dent near-term returns on very large capital commitments.

The road ahead, next five years

Over the next five years, expect India's first fab and ATMP facilities to move through their yield ramps, a second wave of PLI/DLI-backed projects to add capacity, and India's fabless design ecosystem to keep growing off a genuinely strong existing engineering talent base.

The realistic five-year outcome is not India competing with TSMC at the leading edge, it is India securing a meaningful, defensible position in mature-node fabrication, packaging and chip design, categories where the barriers to entry, while still high, are not the near-impossible ones guarding the industry's absolute cutting edge.

Five questions worth asking

  1. 01

    Will the Tata-PSMC fab's yield ramp through 2026-27 validate India's mature-node strategy, or will early struggles cast doubt on the broader plan?

  2. 02

    Can India's design ecosystem, supported by DLI, produce chip design companies that scale globally, rather than remaining primarily an R&D outpost for foreign companies?

  3. 03

    Will India ever gain access to leading-edge lithography equipment, or will mature-node manufacturing remain its ceiling for the foreseeable future?

  4. 04

    Can India's semiconductor investments stay attractive through a full global chip industry cycle, not just the current AI-driven upswing?

Sources & methodology

Figures on this page are drawn from the following primary and secondary sources, cross-checked where more than one was available. Ranges are shown, rather than a single false-precision number, where sources disagreed.

  • India Semiconductor Mission and Ministry of Electronics and Information Technology (MeitY)
  • Press releases and investor disclosures, Tata Electronics and Micron Technology
  • Statista, foundry market share data
  • Market research aggregation for global and India semiconductor market sizing
  • China Briefing, SemiWiki and industry trade press reporting on FY2025-26 developments

All concepts in Semiconductors

30 concepts

#155

Advanced Packaging

Why how you glue chips together matters almost as much as the chips themselves

advanced
#081

ATMP & OSAT

Why India's chip story started with packaging, not fabrication

intermediate
#089

Chip Design

The invisible engineering work that happens before a single wafer is touched

beginner
#152

Chiplet

Why the newest chips are increasingly built from smaller pieces instead of one giant piece

advanced
#850

Compound Semiconductors: Beyond Silicon

The specialised chip materials quietly making electric vehicles and 5G networks more efficient

advanced
#084

DLI: Design Linked Incentive

Paying India's chip design startups to design, not just to build

intermediate
#090

EDA: Electronic Design Automation

The specialised software without which no modern chip could be designed

advanced
#151

EUV: Extreme Ultraviolet Lithography

The technology so hard to build that only one company in the world makes it

advanced
#083

Fab

The single hardest facility in the world to build from scratch

beginner
#845

Fabless vs IDM: India's Strategic Choice

Why most of India's semiconductor startups design chips but deliberately never plan to manufacture them

intermediate
#086

Foundry

The chipmaker that builds someone else's design, not its own

intermediate
#846

iCET: The India-US Semiconductor Partnership

How chip cooperation became a formal pillar of the broader India-US technology relationship

advanced
#082

India Semiconductor Mission & PLI

The economics behind India's biggest industrial bet in a generation

advanced
#849

India's Chip Design Talent Pool

The quiet reason nearly every major global chipmaker already has a large engineering team in India

beginner
#154

IP Core Licensing

Why most chip designers don't actually design a chip from scratch

intermediate
#150

Lithography

The single most difficult step in making a modern chip

advanced
#842

Micron's Sanand Plant: Memory Chips, Assembled in India

The first major global memory chip maker to bet on India, and what its factory actually does

intermediate
#148

Node Size (nm)

The number that used to mean something simple, and now doesn't quite

intermediate
#087

Packaging

The protective shell every chip needs before it can be used

beginner
#844

RISC-V: The Free Chip Architecture India Is Betting On

Why building chips on an open-source design, rather than licensing ARM's, has become a genuine Indian strategy

advanced
#153

System on Chip (SoC)

How an entire computer got squeezed onto a single piece of silicon

intermediate
#843

Tata's Assam Assembly Plant: Chip Manufacturing Reaches the Northeast

Why a semiconductor packaging facility ended up in Assam rather than an established industrial hub

beginner
#841

Tata's Dholera Fab: India's First Chip Fabrication Plant

The Rs 91,000 crore bet that India could finally build the one piece of the chip supply chain it never had

intermediate
#088

Testing

The quality check that catches a defective chip before it reaches a customer

beginner
#852

The 2021 Chip Shortage That Started It All

How empty car lots and delayed laptop shipments convinced India it needed its own semiconductor industry

beginner
#851

The Handful of Companies That Control Chipmaking Equipment

Why building a fab means depending entirely on just a few foreign equipment suppliers, no matter where the fab is located

advanced
#848

The Supporting Cast Behind India's Chip Fabs

The smaller companies building the packaging and testing ecosystem around India's headline semiconductor projects

intermediate
#085

Wafer

The blank canvas every chip in the world begins as

beginner
#847

Why India Is Starting With Older Chip Technology, Not the Newest

The deliberate strategic logic behind building 28nm chips while the world's leaders race toward 2nm

intermediate
#149

Yield Rate

The number that quietly decides whether a fab is actually profitable

intermediate